Automated SMT Solder Paste Storage & Management System by SUBIT

In SMT electronic manufacturing, solder paste quality directly determines soldering yield and long-term product reliability. Traditional manual solder paste management suffers from unstable temperature control, inconsistent temperature recovery, poor FIFO compliance, limited traceability and high labor costs, which lead to material degradation, production defects and avoidable waste.
SUBIT presents the intelligent SMT solder paste storage management system (SM-SP300P / SM-SP600P) — an all-in-one automated solution integrating refrigerated storage, smart temperature recovery, automatic stirring, barcode inventory control and MES connectivity. It digitizes the full solder paste lifecycle to eliminate human error, reduce material waste and improve overall SMT line efficiency.
Core Features & Advantages
Precision Industrial Refrigeration
Industrial-grade compressor delivers stable 1~10°C refrigeration with ±1.0℃ tolerance, preserving solder paste activity and shelf life.
Drawer layered design minimizes cold air loss; real-time temperature display with over-temperature alarm and automatic anti-icing defrosting.
Available in 300-bottle (SM-SP300P) and 600-bottle (SM-SP600P) capacities to match different production scales.
Smart Temperature Recovery with Error Prevention
Dedicated recovery zone (79/149 bottles) with 18~28℃ controlled environment and optimized air circulation.
Supports automatic timing, manual reservation and MES online triggering; recovery duration adjustable from 0.1 to 99 hours.
Timeout auto-return mechanism: uncollected paste automatically returns to refrigeration and is marked for priority use to prevent activity loss.
Integrated Automatic Stirring
Built-in module handles 1–2 bottles per batch, with adjustable speed (100–1000 rpm) and time (1–10 minutes).
Continuous belt buffer feeding enables fully hands-free operation for consistent paste homogeneity.
Automated Inflow & Outflow with Strict FIFO
High-speed automatic code reading supports 1D barcode / QR code on bottle side or top surface, processing each bottle in under 3 seconds.
Permission-based on-demand collection, post-use code cancellation and configurable timeout warning.
Allows 2–3 return storage cycles with priority reuse; strict FIFO discharging by loading/production date eliminates expired material waste.
Industrial Reliability & Digital Traceability
4-level permission protection, triple identity verification (fingerprint + IC card + password) and three-color audible & visual alarm.
PC+PLC control architecture with touch operation; absolute encoder servo module for stable performance and easy maintenance.
Full forward/reverse barcode traceability, real-time data reporting, customizable inventory and expiry early warning.
Personalized MES system docking to support smart factory digital management.
Model Comparison

Applications & Value
The system is widely deployed in automotive electronics, medical device manufacturing, consumer electronics, aerospace electronics, EMS factories and SMT R&D centers. It helps manufacturers standardize solder paste management, reduce quality risks, lower labor costs and meet strict industry quality standards such as IATF 16949.
FAQ
Q: What is the refrigeration temperature accuracy?
A: It maintains a stable 1~10°C range with ±1.0℃ tolerance, compatible with most mainstream leaded and lead-free solder pastes.
Q: Does it support integration with existing MES?
A: Yes. It supports customized MES docking, including work order binding, online recovery control and real-time data synchronization.
Q: How does the system enforce FIFO?
A: It automatically records each bottle’s loading time and production date, discharges strictly by FIFO rule, and prioritizes returned paste for reuse.