Non Vacuum Centrifuge Defoaming Mixer: Solve Bubbles & Mixing Unevenness for Electronic Adhesives

In the electronic manufacturing industry, the quality of electronic adhesives (such as epoxy resin, silicone adhesive, and solder paste) directly affects the reliability of electronic components. However, traditional mixing and defoaming methods often face two major pain points: uneven material mixing and difficult-to-eliminate microbubbles. These problems lead to poor conductivity of electronic adhesives, insufficient bonding strength, and even insulation failures of encapsulated components, resulting in product scrap and increased production costs.
How Does Non Vacuum Centrifuge Defoaming Mixer Solve These Pain Points?
The Non Vacuum Centrifuge Defoaming Mixer integrates high-speed centrifugal stirring and defoaming functions, which can simultaneously achieve uniform mixing and efficient defoaming of electronic adhesive materials in a non-vacuum environment. The strong shearing force generated by centrifugal stirring quickly breaks up powder agglomerates in the adhesive, ensuring that components such as conductive powder and resin are evenly dispersed at the micro level, thus improving the conductivity and bonding stability of the adhesive.
For microbubbles that are difficult to eliminate in traditional processes, the strong centrifugal field pushes the bubbles to the surface of the material to rupture and discharge, with a defoaming rate far higher than that of static defoaming or ordinary stirring defoaming. It effectively avoids defects such as pinholes and voids in electronic component encapsulation and coating, and greatly improves the qualified rate of electronic products.
Why Is It More Suitable for Electronic Manufacturers Than Vacuum Equipment?
Compared with vacuum centrifugal defoaming machines, the non-vacuum type does not require a vacuum system, which reduces equipment purchase and maintenance costs. At the same time, the non-vacuum environment avoids the loss of volatile components in electronic adhesives and the deterioration of heat-sensitive materials due to high temperature, which is more suitable for the processing of special electronic adhesives such as photosensitive resin and bio-adhesive. In addition, the operation is simpler, and one-key start-up can complete the mixing and defoaming process, reducing the difficulty of operation and human error.
If you are looking for a cost-effective solution to solve the problems of electronic adhesive mixing and defoaming, contact us to get the customized parameters of the Non Vacuum Centrifuge Defoaming Mixer for electronic manufacturing