Automatic Stencil Inspection Machine: Revolutionizing PCB Production

In the production of surface mount technology, stencil, as a key tool for solder paste printing, its quality directly affects the accuracy and yield of PCB assembly. Traditional artificial stencil inspection methods are inefficient, error-prone, and difficult to meet the production requirements of high-density and miniaturized electronic components. The automatic stencil inspection machine came into being and has become one of the core equipment in modern SMT production lines to ensure quality and improve efficiency.
1. What is an automatic stencil inspection machine?
Automatic stencil inspection machine is a kind of equipment that uses high-precision optical imaging and intelligent algorithms to perform automatic non-destructive testing of the size, position, shape, blockage, damage, etc. of the stencil. It captures stencil images through high-speed cameras, combined with image processing software, analyzes the stencil status in real time to ensure that it is in optimal working condition before solder paste printing.
2. Core functions and technical advantages
1. High-precision optical imaging system
It adopts high-resolution CCD/CMOS camera and professional light source system
It supports micron-level (μm) accuracy measurement and can detect small openings of 0.1mm or less
Suitable for all kinds of stencil materials (stainless steel, nano-coating, electroformed stencil, etc.)
2. Intelligent defect identification algorithm
Solder Paste Clogging
Detect hole deformation, edge burrs, and hole wall damage
Identify structural defects such as position shifts, porosity, and olivia
3. Efficient and automated operation
Fully automatic loading and unloading system, supporting continuous batch inspection
Inspection speed up to 30–60 seconds/piece (depending on stencil size and complexity)
Unattended operation, greatly reducing labor costs
4. Data-based quality management
Generate inspection reports (including defect location diagrams and dimensional deviation data)
Support SPC statistical analysis to achieve process control
Data traceability and compliance with quality standards such as ISO/TS16949
3. Purchase suggestions
When choosing automatic stencil inspection equipment, the following key indicators should be paid attention to:
1. Detection accuracy (resolution ≤ 5μm)
2. Detection speed (adapted to the cycle time of the production line)
3. Compatibility (support stencil size, thickness range)
4. Software ease of use (user interface, report customization function)
5. After-sales service and technical support capabilities